Omron, a Japanese medical and industrial equipment giant, has made its debut at the Taiwan International Semiconductor Show, showcasing its new 3D X-ray inspection systems. Designed to address growing challenges in semiconductor packaging, these systems offer enhanced precision in inspecting complex 3D chip structures, which are becoming essential with the rise of advanced technologies like 5G/6G and AI.
As chip miniaturization progresses, the need for more accurate detection during production has intensified, particularly with the increased use of Chiplets and 3D packaging. Traditional 2D X-ray systems are no longer sufficient, prompting Omron to launch three new CT-type models—VT-X750-XL, VT-X850, and VT-X950. These systems utilize Omron’s expertise in medical imaging to deliver high-resolution 3D images, allowing manufacturers to perform fast, on-site quality inspections.
The inclusion of proprietary AI technology further enhances the system’s efficiency, automating tasks that previously required skilled technicians. Omron’s entry into the semiconductor space highlights its commitment to innovation as it leverages its decades of experience in medical and industrial automation to meet the growing demands of the semiconductor industry.
