LG Innotek has announced a strategic partnership with Ansys, a leader in engineering simulation, to enhance its digital transformation efforts. The collaboration, revealed on August 8, focuses on deploying digital twin technology across LG Innotek’s operations using advanced digital transformation (DX) technologies, including 3D modeling and artificial intelligence (AI).
Digital twin technology, which replicates real-world objects in a virtual environment, allows LG Innotek to simulate potential scenarios and predict outcomes more effectively. By leveraging Ansys’s expertise in 3D modeling, AI, and machine learning, LG Innotek aims to streamline its research and development (R&D) processes. This approach has already led to significant efficiency gains, reducing development times by up to 99% in certain areas, such as the development of package substrates for semiconductors.
The company has successfully expanded the use of digital twins to optimize its flip-chip ball-grade array (FC-BGA) production, cutting ramp-up times in half and enhancing overall productivity in the electronic components sector. LG Innotek plans to further extend digital twin technology across its product lines, including new areas like vehicle communication modules and LiDAR devices.
Additionally, the integration of AI into virtual design and quality verification processes will boost simulation speed and accuracy. AI’s ability to analyze data and suggest optimal solutions will support engineers in making informed decisions, ultimately enhancing productivity and innovation throughout the company.
