Global Unichip Corp. has successfully taped out the world’s first High Bandwidth Memory 4 (HBM4) controller and PHY IP using Taiwan Semiconductor Manufacturing Co.’s N3P process technology, setting a new benchmark in memory solutions critical for artificial intelligence acceleration.
The HBM4 IP supports data rates of up to 12 Gbps under all operating conditions, achieved through a proprietary interposer layout that optimizes signal and power integrity. This represents a significant technical achievement as AI system designers race to overcome memory bandwidth bottlenecks.
Compared to previous-generation HBM3 technology, GUC’s new solution delivers 2.5 times greater bandwidth while improving power efficiency by 50% and doubling area efficiency. The company has integrated proteanTecs’ interconnect monitoring capability for real-time signal observation, enhancing reliability for high-stakes AI deployments.
GUC, headquartered in Taiwan’s Hsinchu Science Park, has been majority-owned by TSMC since 2003 and specializes in ASIC design services. The company continues expanding its portfolio of advanced memory and chiplet interconnect solutions, including its previously announced UCIe and GLink technologies.
“Our commitment to delivering best-in-class 2.5D/3D IPs remains strong,” said Sean Tai, GUC’s president, noting that the company’s integrated solutions meet growing industry demands for AI and high-performance computing applications. The new IP targets next-generation AI accelerators, data centers, and advanced computing chips in an increasingly competitive semiconductor landscape.
