Global Unichip Corp. posted NT$1.764 billion in revenue for September 2023, marking a 9.3% decline from the previous month and a 24.1% drop from the same period last year. Third-quarter revenue reached NT$6.611 billion, down 1.6% from Q2 and 2.9% year-over-year, with cumulative revenue for the first three quarters at NT$19.022 billion, a 4.5% decrease from 2022. September’s revenue was led by wafer products, accounting for 68%, followed by commissioned design (NRE) at 31%.
Amid these revenue challenges, Global Unichip is betting on advanced 3nm HBM3E technology to bolster growth. Recently adopted by major cloud service providers (CSPs) and high-performance computing (HPC) firms, Global Unichip’s new HBM3E controller and physical layer IP leverage the latest 9.2Gbps memory technology. Production of this advanced ASIC is set to begin this year, supporting increased performance for AI applications.
The company’s HBM3E IP has successfully passed technology verification with TSMC’s advanced process nodes, including N3 and N5, and has achieved silicon verification on CoWoS-S and CoWoS-R platforms. Additionally, Global Unichip is collaborating with suppliers like Micron to develop next-gen HBM4 IP, targeting future AI and HPC applications with a focus on enhanced signal and power integrity through patented interposer cabling technology.
