Taiwanese electronics manufacturer Compal Electronics presented its latest server solutions at the OCP Global Summit in San Jose, California, highlighting a shift towards integrated systems and liquid cooling options for enterprise customers.
The company’s OG120-2, a 1U application server supporting four GPUs, offers both air and direct liquid cooling (DLC) options, catering to general-purpose and AI computing needs. Compal also introduced the OD224-4A-L, a 2U two-node design optimized for cloud computing environments and high-density data center applications.
Compal revealed ongoing collaborations with major North American and European cloud service providers (CSPs) to deploy its OG120-2 GPU SKU in immersion cooling solutions, aiming to strengthen its competitive position in the server market.
The company also showcased OCP standardized motherboard designs and its DC-SCM module utilizing OpenBMC for improved system management. Compal’s integrated rack L11 solution, developed in partnership with Kangshu Technology, demonstrates its capability to provide vertically integrated products for CSPs.
While Compal’s offerings appear innovative, the long-term impact on its market position and financial performance remains to be seen.
