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All Ring Tech Expects Surge in Demand for 2.5D and 3D Packaging Driven by AI Applications in 2023

Taiwan
a 6187.TWO Tech 350
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Today, automation equipment factory All Ring Tech emphasized the imminent upswing in demand for 2.5D and 3D packaging, driven by the proliferation of artificial intelligence (AI) applications in the upcoming year. The company expresses optimism about its operations as the depletion of customer inventory signals a shift towards increased demand in the semiconductor industry.

During the cabinet purchase performance conference, Deputy General Manager Li Jiande conveyed the company’s positive outlook on semiconductor equipment demand for the next year. Regarding passive components, Li noted that although customer utilization rates have rebounded, the actual purchase of equipment is expected to materialize once the utilization rate surpasses 100% in the second half of the following year.

In the first three quarters of this year, All Ring Tech’s operational composition consisted of approximately 76% for semiconductors, 8% for passive components, and 16% for LED equipment/consumable equipment. Despite the revenue for the same period registering at 835 million yuan, reflecting a year-on-year decline of 57.35%, and an operating profit of 12 million yuan, down by 97.2%, the company remains resilient. The injection of non-industry income resulted in an after-tax net profit of 73 million yuan, marking an 84.66% year-on-year decrease. The after-tax earnings per share stood at 0.9 yuan, reaching the lowest level in nearly 11 years for the same period. Wanrun’s strategic focus on emerging AI-driven demands in semiconductor packaging positions the company for growth in the evolving tech landscape.

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