TSMC is ramping up its global expansion with strong government support from Japan and China, securing NT$7.956 billion (approximately USD $250 million) in subsidies during the first half of 2024. This brings its total government aid from both countries to NT$62.5 billion (USD $1.96 billion). The funding supports the company’s aggressive expansion, including facility development and operational costs in Kumamoto, Japan, and Nanjing, China.
The semiconductor giant has been a prime target for government investment due to its technological leadership in the global market. TSMC’s international footprint is growing, with significant developments in Japan, China, the U.S., and Europe. The company recently commenced land preparation for a new wafer fab in Dresden, Germany, backed by a €5 billion subsidy package from the European Commission.
In addition to ongoing projects in Japan and Arizona, TSMC continues to draw significant attention from governments eager to secure a share of the semiconductor supply chain. However, despite a promising USD $6.6 billion subsidy announced by the U.S. government, TSMC has not yet received these funds.
