Taiwan Semiconductor Manufacturing Co. unveiled plans to invest US$15.5 billion in new facilities and advanced technology capacity, highlighting the chipmaker’s push to maintain its industry leadership.
The world’s largest contract chipmaker will direct the funds toward fab construction, facility systems, and research and development for 2025. The investment comes as TSMC reported third-quarter net income of NT$325.26 billion (US$10.2 billion), demonstrating sustained demand for advanced semiconductors.
The company plans to raise up to NT$60 billion (US$1.88 billion) through domestic bond offerings to support its expansion and environmental initiatives. This financing strategy aligns with TSMC’s ongoing efforts to boost production capacity amid global semiconductor supply chain realignment.
For the third quarter, TSMC posted revenue of NT$759.69 billion (US$23.8 billion). The board approved a cash dividend of NT$4.50 per share, payable to shareholders of record as of March 24, 2025.
The expansion strategy reflects TSMC’s response to increasing competition in the semiconductor industry, particularly as rivals in South Korea and the United States ramp up their chip manufacturing capabilities. The company’s substantial investment signals its determination to retain its technological edge in advanced chip production.
