TSMC has signed a memorandum of understanding with Amkor Technology, Inc. (Nasdaq: AMKR) to expand its semiconductor ecosystem in Arizona. Under this agreement, TSMC will utilize Amkor’s advanced packaging and testing services at a new facility in Peoria, supporting its own advanced wafer fabrication operations in Phoenix.
The partnership aims to streamline production by combining front-end and back-end processes, significantly reducing product cycle times. TSMC will integrate technologies such as its Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®) to meet customer needs in high-performance computing and communications markets.
By enhancing its U.S. presence, TSMC strengthens its supply chain resilience and geographic flexibility, addressing growing demand for advanced packaging technologies. This collaboration with Amkor reflects TSMC’s commitment to supporting its customers’ needs while reinforcing the U.S. semiconductor manufacturing ecosystem.
