Samsung Electronics has launched development of its ambitious 1.0-nanometer foundry technology, accelerating efforts to regain ground against Taiwan Semiconductor Manufacturing Co. in the advanced chip manufacturing race.
The South Korean chipmaker has formed a dedicated team for what it calls the “dream semiconductor process,” transferring researchers from existing cutting-edge projects to spearhead the initiative. The company is targeting mass production around 2029, pushing beyond its previously announced roadmap that identified 1.4nm technology as its most advanced node scheduled for 2027.
Industry sources indicate the 1.0nm development will require revolutionary technical concepts and next-generation equipment including High-NA EUV lithography machines, which Samsung reportedly began installing at its Hwaseong campus earlier this year.
While TSMC maintains leadership in current manufacturing processes, Samsung sees an opportunity to leapfrog its rival in futuristic technologies. TSMC’s 2nm process has reportedly reached yields exceeding 60%, significantly ahead of Samsung’s approximately 30% yield rate.
The push toward advanced nodes comes amid intensifying competition in artificial intelligence chip manufacturing, with both companies racing to meet escalating technical demands. Samsung Foundry’s new chief Han Jin-man has recently been meeting with domestic AI chip startups to strengthen partnerships and address customer requirements.
Samsung’s intensified focus on breakthrough semiconductor processes follows recent comments from Chairman Jay Y. Lee, who urged executives to maintain the company’s tradition of technological innovation and “create the future with technologies that don’t yet exist in the world.”
Meanwhile, TSMC isn’t standing still, having announced plans last year to introduce an intermediate 1.6nm node in late 2026, creating a stepping stone toward more advanced processes while addressing current market demands for AI computing.
