MediaTek has launched three new mobile chipsets manufactured using TSMC’s advanced process nodes, targeting the mass market with enhanced gaming performance and AI capabilities. The Dimensity 7400, 7400X, and 6400 chips unveiled on February 25 represent MediaTek’s comprehensive strategy in the smartphone market, potentially setting the stage for deeper collaboration with NVIDIA in mobile chips.
Industry sources suggest MediaTek and NVIDIA are exploring further cooperation, with speculation that NVIDIA could provide mobile GPUs to help the graphics giant re-enter the smartphone market. The two companies appear to have complementary business interests, with NVIDIA supporting MediaTek’s expansion into PC and automotive markets while MediaTek incorporates NVIDIA’s AI and graphics rendering technologies into its mobile solutions.
The new Dimensity 7400 and 7400X chipsets are manufactured using TSMC’s 4nm process and integrate MediaTek’s NPU 650, delivering a 15% improvement in AI performance over previous generations. The Dimensity 6400, aimed at mainstream markets, is built on TSMC’s 6nm process and brings efficient 5G capabilities to mid-range devices.
Xiaomi and OPPO are expected to be among the first manufacturers to adopt the new chips, with devices scheduled to launch in the first quarter of 2025. The Realme P3x, featuring the Dimensity 6400, has already been released in the Indian market.
