MediaTek and Taiwan Semiconductor Manufacturing Co. unveiled the industry’s first silicon-proven power management unit and integrated power amplifier wireless communication chip based on TSMC’s N6RF+ process technology.
The innovative chip integrates two essential components for wireless communication products into a single system-on-chip (SoC), delivering performance comparable to standalone modules while significantly reducing the footprint. TSMC claims the advanced N6RF+ technology provides double-digit percentage size reduction and increases overall component density compared to existing solutions.
MediaTek plans to leverage this technological advancement to maintain competitive edge in its next-generation products. The company contributed product and integrated circuit design expertise during the collaboration, while TSMC optimized the manufacturing process.
MediaTek Vice President Wu Qingshan noted that the year-long partnership resulted in a test chip with exceptional energy efficiency, creating a competitive advantage for radio frequency SoC projects.
TSMC’s Senior Director Yuan Liben emphasized that successful design-technology co-optimization depends on mutual trust and teamwork between manufacturers and clients, highlighting TSMC’s leadership in integrating advanced logic processes with specialized process technologies.
