Winbond Electronics reported September revenue of NT$7.231 billion, a 3.34% increase from August and up 6.87% year-over-year, marking the third-highest monthly revenue for 2024. Cumulative revenue for the first nine months reached NT$62.918 billion, up 12.69% compared to the same period in 2023, buoyed by solid growth across its DRAM, NOR, and NAND segments.
As part of its growth strategy, Winbond is transitioning from DDR3 to DDR4 DRAM, expecting strong shipments of DDR4 to drive further gains in the latter half of 2024. In the NOR Flash market, supply constraints are emerging as Chinese manufacturers shift focus to logic wafers, tightening NOR availability and potentially leading to a supply shortage by 2025. Similarly, Winbond anticipates high demand for NAND Flash, projecting tight supply dynamics next year.
Winbond’s production is set to advance, with NOR Flash moving to a 45nm process and new SLC NAND Flash products. In DRAM, production will shift to 20nm, with expanded offerings across at least 10 specifications. The Kaohsiung plant has ramped up its capacity by 50% to 15,000 wafers per month, while planned capital expenditures have been adjusted down from NT$17.4 billion to NT$16 billion, focusing on equipment for Kaohsiung and Taichung facilities.
With a strategic focus on next-gen memory processes and capacity expansion, Winbond aims to capture demand in an increasingly constrained memory market.
