MediaTek Inc. approved a cash dividend of NT$25 ($0.79) per share for the second half of 2024, bringing its full-year payout to NT$54 ($1.72) as the chipmaker prepares to showcase its 6G technology roadmap at the upcoming Mobile World Congress.
The Taiwanese semiconductor firm, which has overtaken Qualcomm as the world’s largest smartphone chip supplier, will maintain a dividend payout ratio of approximately 80.7% based on its 2023 earnings. The company set July 3 as the ex-dividend date with payments to be distributed on July 31.
MediaTek’s shares closed at NT$1,515 ($48.22) on Tuesday, down NT$45 after the announcement.
The chipmaker plans to demonstrate a series of next-generation wireless communication technologies at the MWC event in Barcelona running March 3-6. Industry observers note that after MediaTek’s success in the 5G era, the company is strategically positioning itself to capture emerging 6G opportunities as a key growth driver.
Among the technologies to be showcased is an integrated communication and computing system that combines device cloud with Radio Access Network (RAN) into an “edge cloud.” The company developed this technology in collaboration with Nvidia, Intel, and HTC G REIGNS to achieve low-latency performance in generative AI applications while maintaining telecom-grade privacy protections.
MediaTek will also present its Sub-band Full Duplex (SBFD) technology, which improves spectrum efficiency for future 6G networks. The company claims this physical layer technology significantly enhances uplink coverage and reduces latency on unpaired Time Division Duplex spectrum.
