Hanwha Semitech has achieved a significant milestone by successfully mass-producing TC bonders, critical equipment for manufacturing high-bandwidth memory (HBM) chips used in AI semiconductors. The company announced Thursday it has finalized a purchase agreement with SK Hynix after passing the customer’s final quality verification tests.
This marks Hanwha Semitech’s first actual delivery of HBM TC bonders to a customer. The company received an official purchase order for its “SFM5-Expert” TC bonder from SK Hynix recently, representing a major achievement in a relatively short timeframe since beginning rigorous quality testing last year.
By successfully navigating intense quality verification processes and reaching mass production capability, Hanwha Semitec has gained entry into the HBM TC bonder market. More importantly, this achievement allows the company to join Nvidia’s global semiconductor supply chain.
A Hanwha Semitech representative noted that the company leveraged its existing flip-chip bonding technology and expertise to develop the HBM TC bonder in just four years since initiating the project in 2020.
Having recently rebranded as a “semiconductor equipment specialist,” Hanwha Semitech plans to expand aggressively into various semiconductor front-end and back-end process markets, supported by significantly increased R&D investments.
