ASE Technology Holding Co. formed an alliance with Pegatron Corp. and Pelitech Co. to develop artificial intelligence-based inspection systems for semiconductor substrates, expanding automation efforts in Taiwan’s chip packaging industry.
The partnership, called AI Application Appliance (AAA), aims to reduce manual inspection processes in substrate manufacturing. The consortium includes substrate makers like Kinsus Interconnect Technology Corp., Nan Ya PCB Corp., and Unimicron Technology Corp.
ASE, which has been implementing AI solutions since 2011, claims its visual inspection technology has cut labor requirements by 80% while achieving complete real-time product examination. The company’s procurement chief Tang Ruei-wen said this marks the first cross-industry collaboration between packaging, substrate manufacturing, and software sectors.
The alliance builds on ASE’s existing automation initiatives, which the company attributes to three factors: work passion, technical expertise, and expert management. By standardizing AI inspection across the industry, the consortium seeks to improve efficiency in Taiwan’s semiconductor supply chain.
Pegatron, a major AI server manufacturer, brings its smart manufacturing experience to the partnership, while Pelitech contributes core image recognition algorithms developed through previous collaboration with ASE.
