On September 3, SK Hynix made a significant statement in the AI technology landscape during the “Heterogeneous Integration Global Summit 2024” in Taipei, Taiwan. Vice President Kangwook Lee presented the company’s cutting-edge advancements in High Bandwidth Memory (HBM) and packaging technology, positioning SK Hynix as a leader in custom memory solutions for the AI era.
Lee’s presentation underscored the growing importance of heterogeneous integration technology, which combines different semiconductor processes into a single package. This technology is critical for the development of SK Hynix’s sixth-generation HBM4, which is slated for mass production in 2025. The new HBM4 will feature 12 and 16-layer configurations, with capacities up to 48GB and data processing speeds exceeding 1.65TB per second.
In collaboration with TSMC, SK Hynix is leveraging TSMC’s 5-nanometer process to enhance the base die of HBM4. This partnership aims to boost performance and energy efficiency, key demands in the rapidly expanding AI market. The company is also advancing its MR-MUF packaging technology, which offers significant advantages in heat dissipation and is set to be used in HBM4’s production.
As the AI market continues to grow, with projections showing a 109% annual increase in the HBM sector from 2022 to 2025, SK Hynix is positioning itself to meet the demand with its next-generation memory solutions.
