ASE Technology Holding, a major player in semiconductor packaging and testing, reported consolidated revenue of NT$52.93 billion ($1.65 billion) for August, marking a 2.6% increase from the previous month and a 1.2% rise year-on-year. The company attributed this performance to growing customer demand for artificial intelligence (AI) chips, leading to strong results in advanced packaging and testing services.
Revenue from packaging, testing, and materials reached NT$29.175 billion, up 6.3% from July and 2.4% annually. For the first eight months of 2024, ASE’s total revenue stood at NT$377.566 billion, a 2.66% increase compared to the same period in 2023.
To meet rising demand, ASE is expanding its advanced packaging capabilities. In August, the company acquired the K18 factory in Kaohsiung to boost production of wafer bump and flip-chip packaging. Construction of a new K28 facility is also underway, scheduled for completion in late 2026, focused on packaging for AI chips and high-performance computing (HPC).
The company has ramped up capital expenditure this year, doubling its investment over 2023, with 53% allocated to advanced packaging. ASE’s capital expenditure is expected to exceed NT$30 billion in 2024, a record high for the company, as it scales operations to meet the increasing demand for AI and HPC chip testing.
